Stable/Medical Laser Isotope Separation

Engineering advanced materials for semiconductor and medical industries

The technology is based on patented CRISLA technology. It is high throughput, modular, and scalable. It has been demonstrated with uranium hexafluoride for the nuclear industry at TRL4. The system is capable of high-purity enrichment. It is clean, efficient, and has a small footprint. The technology offers a low cost in terms of CapEx and OpEx. LIST has deep roots in the semiconductor industry. A global market analysis is currently underway.

Laser Separation of Silicon-28: Next-gen chips for AI and High Power Computing

Better Heat Management

  • Reduced cooling demands

  • Boost in chip efficiency

Better Heat Management

  • Reduced cooling demands

  • Boost in chip efficiency

Better Heat Management

  • Reduced cooling demands

  • Boost in chip efficiency

Laser Separation of Silicon-28:
Quantum Computing

Ultra-Low Nuclear Spin

  • Reduced magnetic noise
  • Longer coherence times for qubits
  • More stable quantum operations
  • High Qubit Fidelity

Compatible with Existing
Semiconductor Technology

  • Facilitates scaling quantum devices
    using existing infrastructure

Scalability

  • Leading candidate for quantum
    computing platforms

Laser Separation of Medical Isotopes: Diagnostics and Therapy

Energy-efficient process

  • Low power requirements

Compact design

  • Low footprint
  • Potential for in-situ production,
    reducing logistics costs

Versatility

  • Suitable for selection of isotopes

Modularity

  • Production volume scaling